Feature

1. The new combined working platform makes maintenance more convenient.

2. Heating up and down at the same time, especially suitable for removing BGA and other chips that need to be preheated.

3. It can be adjusted according to the size of the circuit board.

4. The functional device for vacuum suction and release of chips can be selected according to needs.

Specification

model	QUICK I760 bracket
Max circuit board size	420*400mm
Can be equipped with preheating station	855T+
weight	20kg